BoPin 440 Wood Floor Joint Sealant

BoPin 440 is a single-component, moisture-curing MS polymer sealant and adhesive specifically formulated for solid wood and engineered wood floor installation and joint filling. Based on modified silane polymer technology, it cures at room temperature to form a strong, highly elastic rubber that bonds and seals wood floor joints with excellent flexibility. The extended open time allows efficient application across large floor areas before board placement, and the cured body accommodates the natural expansion and contraction of wood flooring without cracking or debonding. Compatible with both solid and engineered wood types including strip flooring, parquet, thick strip, mosaic strip and timber boards.

Temel Faydalar
  • Excellent elasticity — elongation at break 469%, accommodates natural wood movement without joint failure
  • High tensile strength — 2.13 MPa provides strong, durable bond between floor boards
  • Extended open time — allows efficient work across large floor areas before board placement
  • Good adhesion to wood, aluminium and glass substrates without primer
  • Solvent-free formula — safe for use in occupied or enclosed interior spaces
  • Low odour — suitable for residential and commercial interior flooring applications
Adhere To
  • Solid timber and engineered wood boards
  • Parquet and mosaic wood strips
  • Wood-based panels and hardboard
  • Aluminium transition profiles
  • Concrete subfloor (as bonding substrate)
Application Areas
  • Solid wood floor joint filling and board bonding
  • Engineered wood floor installation — strip, long strip, thick strip and mosaic strip
  • Industrial wood flooring installation
  • Residential veneer panel and hardboard bonding
Paket
600ml sausage pack — 20 units per carton Available colors upon request

Ek bilgi

Kürleme Sistemi

MS Polymer (moisture cure)

Density (g/cm³)

1.39

Sertlik (Shore A)

40

Çekme Dayanımı

2.13 MPa

Kopma Uzaması

469%

Cure Rate (depth)

2.5 mm / 24 hours

Deri Oluşum Süresi

approx. 46 min

Aluminium Bonding

Pass

Glass Bonding

Pass

Raf Ömrü

12 months (unopened, ≤27°C)

Renk

Customized

Application Fields

  • Yüzey Hazırlığı — Ensure the subfloor and wood surfaces are clean, dry and free from dust, grease and loose material. Allow wood flooring to acclimatise to the installation environment before applying.
  • Uygulama — Cut cartridge tip at 45°, load into sealant gun and apply into floor joints or bonding areas with steady, even pressure. Work in manageable sections within the open time.
  • Curing — Allow to cure at room temperature. Avoid heavy foot traffic for at least 24 hours. Full mechanical properties develop after 7 days.
  • Temizlemek — Remove uncured product with a suitable solvent before skin formation. Cured product must be removed mechanically.
Limitations
  • Not suitable for continuous water immersion or permanently wet floor areas — use appropriate waterproof flooring systems for wet rooms
  • Not suitable for use on PE, PP or PTFE surfaces
  • Not recommended for exterior flooring exposed to direct weathering
  • Not suitable for structural load-bearing applications
  • Do not apply when substrate temperature is below 4°C or above 40°C
  • For flooring over underfloor heating systems, confirm compatibility with the flooring manufacturer before use
İpuçları
  • Allow wood flooring to acclimatise to the installation room for at least 48 hours before installation to minimise post-installation movement
  • For large-format solid wood boards, ensure adequate expansion gaps at perimeter walls — the sealant accommodates joint movement but cannot substitute for proper floor design
  • Extended skin formation time (≥46 min) is a useful feature for large floor projects — take advantage of the open time for efficient board placement before the product skins
  • Store cartridges upright in a cool, dry location away from heat and direct sunlight

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